ECE Research - Microelectronic Packaging and Interconnects

Faculty

• Dvorak, Steven L.
• Ma, Dongsheng (Brian)
• Melde, Kathleen L.
• Palusinski, Olgierd A.
• Wang, Janet

Research Centers and Labs

• CEPR: Center for Electronic Packaging Research(Profs. Dvorak, Ma, Melde, and Wang)
• CMSL: Circuit Modeling and Simluation Laboratory (Prof. Palusinski)
• CEML: Computational Electromagnetics Laboratory(Profs. Dvorak, Melde and Ziolkowski)

Related Undergraduate Technical Electives

• ECE/MSE 465 Microelectronic Packaging Materials
• ECE 481 Microwave Measurements
• ECE 486 Microwave Engineering I: Passive Circuit Design

Related Graduate Courses

• ECE/MSE 554 Electronic Packaging Principles
• ECE/MSE 565 Microelectronic Packaging Materials
• ECE 586 Microwave Engineering I: Passive Circuit Design
• ECE 588 Microwave Engineering II: Active Circuit Design
• ECE 654 Electronic Packaging Design