Research
Microelectronic Packaging and Interconnects
Faculty
Research Centers and Labs
- CEPR: Center for Electronic Packaging Research (Profs. Dvorak, Ma, Melde, and Wang)
- CMSL: Circuit Modeling and Simluation Laboratory (Prof. Palusinski)
- CEML: Computational Electromagnetics Laboratory (Profs. Dvorak, Melde and Ziolkowski)
Related Undergraduate Technical Electives
- ECE/MSE 465 Microelectronic Packaging Materials
- ECE 481 Microwave Measurements
- ECE 486 Microwave Engineering I: Passive Circuit Design
Related Graduate Courses
- ECE/MSE 554 Electronic Packaging Principles
- ECE/MSE 565 Microelectronic Packaging Materials
- ECE 586 Microwave Engineering I: Passive Circuit Design
- ECE 588 Microwave Engineering II: Active Circuit Design
- ECE 654 Electronic Packaging Design