| Welcome |
| The Center for Electronic Packaging Research (CEPR) performs funded research in the areas of electrical and thermal characteristics of electronic device packages, and interconnected devices. The main activity is in modeling and simulation of electrical and thermal characteristics of electronic packaging, and experimental verification of the modeling results. Founded by the late Dr. John L. Prince III, a member of ECE's faculty for 22 years, the program's support has been provided primarily by research contracts and student fellowships from Semiconductor Research Corporation. Professor Prince was instrumental in creating SRC's packaging program, serving as Distinguished Visiting Scientist and Director of Packaging Sciences at SRC in 1991-1992. CEPR continues his legacy of leadership and innovation in an industry that is ultimately dominated by the electrical performance and characteristics of electrical system package and interconnects. |
