ECE 654
Spring 2003 - Syllabus - Tentative IC
702-E
Electronic Packaging Design
Instructor: Olgierd A.
Palusinski
Department
of Electrical and Computer Engineering
University of
Arizona, Tucson
Tel: (520) 621-4928
Tel.: (520)
621-6094 (Secretary)
FAX: (520) 626-9241 (Fax serving Microelectronics Group)
FAX: (520)
621-8076 (Main Office)
E‑mail:
palusinski@ece.arizona.edu (preferred
medium for communication)
Web
page: http://www.ece.arizona.edu/~cmsl
Office Hours: T, Th.: 9:30 – 10:30 AM or by appointment
Class: 3:30 – 4:45 PM; T, Th; room Harvill 211.
Prerequisites: Graduate standing in engineering or science. ECE 554
(NTU: IC 701‑E) is
recommended but not required. ECE 554 can be
taken concurrently.
Textbook: None. Class notes
will be available to students and readings from
the
reference texts will be suggested.
Reference texts:
1. Yang, B., 2001, Digital Signal Integrity: modeling and simulation with interconnects and packaging, Prentice Hall, N. J.
2. Pecht, M., 1991, Handbook of
Electronic Packaging Design, Marcel Dekker, N. Y.
3. Tummala, R. R. and E. J. Rymaszewski (Eds.), 1997, Microelectronics
Packaging Handbook, Van Nostrand Reinhold, N. Y.
4. Shackelford, J. F., 1992,
Introduction to Materials Sciences for Engineers, McMillan, N. Y.
5. Capillo, C., 1990, Surface Mount Technology - Materials, Processes,
and Equipment, McGraw, N. Y.
Course Objectives:
A student
completing this course will be familiar with the fundamentals needed for
analysis and design of packages for integrated circuit applications. This
course will provide analytical tools for the first order solutions to several
packaging design problems. The course crosses traditional boundaries between
engineering specialties and involves electrical engineering, materials
sciences, and mechanical engineering. This is a rapidly developing area of
engineering, with a few universities offering packaging courses. Consequently,
packaging experts are in short supply and industry demand is high.
Course Description:
This course
includes the analysis and design of chip‑ and board‑level packages
and interconnections for integrated circuit applications. Analysis/design
problems have been selected to cover spectrum of module configurations,
performance characteristics, manufacturing technologies, and costs. Electrical,
thermal, and mechanical considerations are presented with their relation to
global performance. Optional term paper (project) allows students to get
involved in solving, simplified, but realistic design problems inspired by an
industrial experience. Research problems will also be considered as term paper
topics.
Homework: Assigned but not collected
Examinations: See grading.
Projects: See grading
Grading:
A.
Term paper option
Final examination: 30%
Midterm examination 20%
Term Paper: 50%
A topic for the term paper
(project) may be selected from the list provided by instructor or proposed by the
student. In either case, the student must submit to the instructor a short,
written proposal of the term paper for approval. For report writing
requirements please consult a separate document.
C.
Examination option
4 written examinations (in the
semester 1hr 15min each, the lowest to be dropped): 70%
Final Examination: 30%
Course topics
1. System integration
2. Packaging materials
3. Thermal management
4. Reliability
1. Technology trends
2. Assembly processes
3. Popcorning in plastic packages
4. Single and multi-chip packages
4. Printed wire boards
1. Electrical modeling
2. Signal integrity in digital systems
3. Signal integrity in mixed-signal
circuits
4. Multilevel system wirability and system
design
1. Modeling
2. Performance metrics
3. Multicriteria optimization
techniques
4. Case study: selection of
optimum number of signal layers in a board.