Microelectronic
Packaging
Short course offered by the Engineering Professional Development Office of the University of Arizona
Phoenix, June 15 - 17, 1998
Holiday Inn, Sun Spree Resort
Scottsdale, AZ
Day 1
1. Introduction - O. A. Palusinski, Univ. of Arizona
2. Packaging Materials - B. Zielinski, Univ. of Arizona
3. System Integration - W. Siu, Intel
Day 2
4. Packaging Thermal Design - M. Mahalingam, Motorola
5. Mechanics of Packaging - V. Sarihan, Motorola
Day 3
6. System Level Considerations - O. A. Palusinski, Univ. of Arizona
7. Electrical Modeling - O. A. Palusinski, Univ. of Arizona
8. Simultaneous Switching Noise - J. L. Prince, Univ. of Arizona